Fig. 1: MDPS design.
From: Advances in high-performance MEMS pressure sensors: design, fabrication, and packaging
a MDPS characterized by a “beam-membrane-quad-island” (BMQI) structure (front and bottom view of the chip)47. b Stress distribution and stress path of the structure. c Comparison of the von Mises stresses of the three structure types. d Four-beam-bossed-membrane (FBBM) structure (front and back review)50. e Back review of FBBM50. f Stress distribution curve of the path50. g Backside view of an ultrahigh-sensitivity pressure sensor chip51. h Circuit on the CBM sensor. i Structure of CBM and X-direction stress distribution curve52
