Fig. 12: Integrated sensor chip design of “pressure + acceleration + temperature + infrared” (PATIR)130. | Microsystems & Nanoengineering

Fig. 12: Integrated sensor chip design of “pressure + acceleration + temperature + infrared” (PATIR)130.

From: Advances in high-performance MEMS pressure sensors: design, fabrication, and packaging

Fig. 12

a Schematic of the integrated sensor. b Photograph showing the prototype PATIR integrated sensor. c Developed single-side-integrated process flow for prototype PATIR composite sensor. d Fabrication process flow of the capacitance pressure and temperature sensor132. e Top view of the CPS132

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