Fig. 2: Fabrication process of a typical MDPS39.
From: Advances in high-performance MEMS pressure sensors: design, fabrication, and packaging
a Process flow, a-1 Cleaning SOI wafer, a-2 Boron implantation to form heavily doped section, a-3 Boron implantation and thermal annealing to form the piezoresistors, a-4 Contact hole etching, a-5 Front side RIE etching to form grooves, a-6 Back side DRIE etching to from peninsula-island structure, a-7 Bonding glass base, b Top view of the typical MDPS
