Fig. 22: FC-based pressure sensor.
From: Advances in high-performance MEMS pressure sensors: design, fabrication, and packaging
a Cross-sectional view of the FC gauge pressure sensor chip. b Cross-sectional view of the FC absolute pressure sensor chip. c Endvoco 8515 C pressure sensor-based FC package173. d Contour of the thermal stress near the Si wafer surface,175.e Directional dependence of the stress distribution in (d) (ΔT = –270 °C)175. f Comparison of thermal stress using FEM simulation and measurement data by Raman spectroscopy187. g Sensor chip mounted on copper springs to reduce mechanical stress on the sensor chip167. h Copper springs in package cavity167. i Top view of the FC chip167
