Fig. 3: SEM images of the deposited Pd catalysts and the resulting Ni layers at the via bottoms for case B, case C, and case D | Microsystems & Nanoengineering

Fig. 3: SEM images of the deposited Pd catalysts and the resulting Ni layers at the via bottoms for case B, case C, and case D

From: An ultra-deep TSV technique enabled by the dual catalysis-based electroless plating of combined barrier and seed layers

Fig. 3

Formed Pd catalysts at the via bottom of a Case B, b Case C after the first Pd2+ reduction, and c Case C after the second Pd2+ reduction. d, e ELP results of Ni in Case C. The inset of d is an enlarged image of the via bottom, revealing the dense Ni layer. The SEM image in e is obtained after metallographic polishing, indicating the continuity of the fabricated Ni layer. f Via bottom of Case D after Ni+ reduction, showing the irregular growth of Ni

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