Fig. 8: Application frameworks in microsystems | Microsystems & Nanoengineering

Fig. 8: Application frameworks in microsystems

From: An ultra-deep TSV technique enabled by the dual catalysis-based electroless plating of combined barrier and seed layers

Fig. 8

a Optical image of a fabricated integrated system containing three dummy chiplets stacked on a TSV-embedded interposer. b Illustration of a microsystem exemplifying the need for ultra-deep TSVs. The ultra-deep TSVs play a pivotal role in facilitating electrical interconnections between the MEMS micromirror and CMOS chiplet within this complex integration architecture

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