Fig. 1: Schematic illustration of the impact of thermal airflow on DIC warpage measurements. | Microsystems & Nanoengineering

Fig. 1: Schematic illustration of the impact of thermal airflow on DIC warpage measurements.

From: Correction of thermal airflow distortion in warpage measurements of microelectronic packaging structures via deep learning-based digital image correlation

Fig. 1

a DIC measurement system capturing a chip within a heating furnace. b Distortions in the sample images captured by the DIC system, induced by thermal airflow effects. c Topographical measurement of an alumina ceramic substrate under thermal airflow disturbance. d Comparison of the measurement results with and without thermal airflow disturbance

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