Table 1 Performance comparison with state-of-the-art temperature-compensated thermal flow sensing systems
Ref. | System packaging | Power consumption (mW) | Sensitivity | Response time (ms) | Flow range (m/s) | Temperature drift | Compensation type |
---|---|---|---|---|---|---|---|
MEMS & PCB circuit | N/A | N/A | N/A | 0–20; N/ALR | ±3.5%Sen (−20 to 40 °C) | Software-based algorithm compensation | |
MEMS & PCB circuit | N/A | N/A | 36b | 0–6.37a; N/ALR | 2.5%Sen (20–34 °C) | Hardware-based circuitry compensation | |
CMOS-MEMS & PCB circuit | <2.77PH | 543 mV/(m/s) | N/A | −11 to 11; −1.3 to 1.3LR | 0.5%Sen (22–48 °C) | Hardware-based circuitry compensation | |
MEMS & PCB circuit | <158.1PH; <333.5PS, a | N/A | N/A | 0–33; N/ALR | 2.7%Sys (0–40 °C) | Software-based algorithm compensation | |
This work | CMOS-MEMS monolithic | <0.92PH; <4.96PS | 156 mV/(m/s) | 87.5b | −10 to 10; −6 to 6LR | ±1.6%Sys (0–50 °C) | Hardware-based circuitry compensation |