Fig. 5: Photovoltaic performance based on the different components and structures.

a The J-V curves of CsPbI2Br perovskite-based inverted devices before and after target encapsulation. b The PCE attenuation curve with UV resin and target encapsulation based on the devices of CsPbI2Br perovskite under damp heat test. c The J-V curves of MAPbI3 perovskite-based normal devices before and after target encapsulation. d The PCE attenuation curve with UV resin and target encapsulation based on the devices of MAPbI3 perovskite under damp heat test. e The J-V curves of CsMAFA perovskite-based modules with 25 cm2 before and after target encapsulation (Effective area is 15.8 cm2). f The PCE attenuation curve with POE and target encapsulation based on perovskite modules under damp heat test. The standard deviations of the three samples are represented by the error bars. The epoxy resin is used for edge sealing for better stability in all encapsulated methods. Source data are provided as a Source data file.