Fig. 2: Cross-sectional microstructures of SAL W-Cu composite and electrolessly plated W-Cu.
From: Simultaneous enhancement of strength and conductivity via self-assembled lamellar architecture
a EBSD IPF map of W phase in the as-prepared SAL W-Cu. Inset: map color legend projected on the plane vertical to VD, showing a texture of <100 > W // VD. b EBSD IPF map of Cu phase in the as-prepared SAL W-Cu. Inset: map color legend projected on the plane vertical to VD. c HRTEM image of the interface in SAL W-Cu. Insets: the corresponding FFT patterns. d Dark field TEM image showing the nanocrystalline Cu in the electrolessly plated W-Cu. e Bright field TEM image showing the elongated W grains in the SAL W-Cu. Insets: the selected area electron diffraction (SAED) patterns and indexing with the zone axes of [001]W and [011]Cu, respectively. The red and yellow dashed lines represent phase boundaries and grain boundaries. f Bright field TEM image of the milled W flake containing dislocations. Inset: an enlarged view. g Bright field TEM image of W phase in SAL W-Cu, showing high-density dislocations. h Schematic sketch of the SAL architecture in the as-prepared W-Cu composite.
