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Flexible electronics

Damage-free transfer printing

Nature Materials volume 23, pages 1313–1314 (2024)Cite this article

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Precise stress control of thin films enables damage-free dry transfer printing onto flexible substrates.

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Fig. 1: Damage-free dry transfer printing via stress engineering.

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Authors and Affiliations

  1. Innovative Center for Flexible Devices (iFLEX), Max Planck – NTU Joint Lab for Artificial Senses, School of Materials Science and Engineering, Nanyang Technological University, Singapore, Singapore

    Yanzhen Li, Jiangtao Su & Xiaodong Chen

Authors
  1. Yanzhen Li
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  2. Jiangtao Su
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  3. Xiaodong Chen
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Correspondence to Xiaodong Chen.

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The authors declare no competing interests.

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Li, Y., Su, J. & Chen, X. Damage-free transfer printing. Nat. Mater. 23, 1313–1314 (2024). https://doi.org/10.1038/s41563-024-01988-9

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