Figure 8
From: Study on electroless Cu plating quality of in situ TiCp

The schematic diagram of various stirring method during the electroless plating process (a) manual stirring with glass rod (b) ultrasonic stirring and (c) magnetic stirring.
From: Study on electroless Cu plating quality of in situ TiCp
The schematic diagram of various stirring method during the electroless plating process (a) manual stirring with glass rod (b) ultrasonic stirring and (c) magnetic stirring.