Figure 1
From: Mechanically-flexible wafer-scale integrated-photonics fabrication platform
Stack diagrams (not to scale) depicting process flow as (a) the silicon-dioxide and silicon-nitride layers are fabricated, (b) a temporary silicon handle wafer is bonded on top of the oxide, (c) the wafer is flipped and the silicon is thinned down, (d) a polyester film is attached on top of the silicon layer, and (e) the wafer is flipped and the temporary silicon handle wafer is removed. Photographs of the fabricated flexible integrated-photonics wafer (f) flat, (g) convexly curved in one direction, (h) convexly curved in the other direction, (i) concavely curved, and (j) curved convexly and concavely simultaneously.
