Figure 3
From: Mechanically-flexible wafer-scale integrated-photonics fabrication platform
(a) Photographs demonstrating the bending procedure for the flexible photonic chip. (b) Five cylinders of diameters ranging from 2 inches to 0.25 inches, used during the bend durability testing. (c) Experimental results showing the normalized power through the chip versus the number of times the chip was bent around cylinders of varying diameters. (d) Micrograph of the photonic chip after it was bent to a diameter of 0.25 inches, showing the failure mechanism of a crack through the waveguide.
