Figure 11
The elemental mapping of Sn58Bi-0.5CeO2/Cu solder joint after current stressing for 600Â h (a) microstructure; (b) Bi; (c) Sn; (d) Cu; (e) Ce.
Figure 11 | Scientific Reports
The elemental mapping of Sn58Bi-0.5CeO2/Cu solder joint after current stressing for 600Â h (a) microstructure; (b) Bi; (c) Sn; (d) Cu; (e) Ce.
