Figure 9
The microstructure of Sn58Bi/Cu solder joints at different current stressing times: (a) anode (96Â h); (b) cathode (96Â h); (c) anode (288Â h); (d) cathode (288Â h); (e) anode (480Â h); (f) cathode (480Â h).
Figure 9 | Scientific Reports
The microstructure of Sn58Bi/Cu solder joints at different current stressing times: (a) anode (96Â h); (b) cathode (96Â h); (c) anode (288Â h); (d) cathode (288Â h); (e) anode (480Â h); (f) cathode (480Â h).
