Table 1 EDS analysis of selected areas of solder joint.

From: Effect of electromigration on microstructure and properties of CeO2 nanopartical-reinforced Sn58Bi/Cu solder joints

Elements (at.%)

Point A

Point B

Point C

Point D

Point E

Point F

Point G

Sn

58.9

0.9

57.6

95.7

64.3

35.1

98.7

Bi

6.7

98.0

8.9

3.0

–

6.5

1.3

Cu

33.6

–

33.5

0.9

34.7

58.4

–

Ce

0.8

1.1

–

0.4

1.0

–

–

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