Fig. 4: Device demonstration of using s-BAs for high-performance thermal management. | Nature Communications

Fig. 4: Device demonstration of using s-BAs for high-performance thermal management.

From: Flexible thermal interface based on self-assembled boron arsenide for high-performance thermal management

Fig. 4

a Optical image of a light emitting diode (LED) and b schematic illustration of its integration with a thermal interface and heat sink. c Time-dependent infrared images of the LED integrated with different materials (thermal epoxy, silicone thermal pad, and s-BAs), indicating temperature distributions near the hot spot. d Comparison of the LED hot spot temperatures using different thermal interface materials.

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