Materials with low dielectric constant and low dielectric loss over a wide temperature range are needed to produce complex and miniaturized integrated circuits. Here, the authors report covalent organic framework films showing ultralow dielectric constant and dielectric loss, low thermal expansion coefficient, and improved mechanical properties. At the same time, the films exhibit prominent thermal conductivity, which is one order of magnitude higher than that of other typical porous dielectric materials.
- Donglin Chen
- Juncheng Sha
- Qixin Zhuang
