Fig. 12
From: Synthesis and analysis of a novel thermal interface material for DC-DC boost converter
Thermal camera images of MOSFET and Heatsink (a) MOSFET without TIM, (b) Heat sink without TIM, (c) MOSFET with thermal grease, (d) Heat sink with thermal grease, (e) MOSFET with sample 1, (f) Heat sink with sample 1, (g) MOSFET with sample 2, (h) Heat sink with sample 2, (i) MOSFET with sample 3, (j) Heat sink with sample 3.
