Fig. 7: Fabrication process of the DSS.
From: Synchronous detection of dual signals based on constant-drive technique of weakly coupled resonators
a Patterning process for the bottom layer; b ICP etching of the base layer; c, d Photoresist removal and gold deposition on the substrate; e Patterning of the structural layer and attaching the support chip; f ICP etching of the structural layer; g Photoresist and support chip removal; h Chip release
